Reed Relays B10 RF Series

Ball Grid Array Relays
Coto's Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology¹ allows for shorter RF paths in a controlled 50 W environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packaging allows relays to be integrated easily on boards designed for surface mount processing.


	Series Features u BGA Surface Mount u Ability to pass GHz signals u Rise time < 40pSec u 50 W Characteristic Impedance u Low Capacitance u Patented Design¹


	Applications u IC Testers u In-Line Relay Testers u Memory Testers u Mixed Signal Testers u High Bandpass Applications


			Dimensions in Inches (Millimeters)




	Notes: ¹ Protected by one or more of the following US Patents: 6025768, 6052045, 6294971, 6683518, RE38381 and other foreign patents.


	B10 RF Relays Specifications Table

			B10
Test Parameters	Conditions^1,2	Min	Typ	Max	Units
Coil Resistance	3.3V Coil	49.5	55.0	60.5	W
Nominal Voltage	3.3V Coil		5.0	4.0	Volts DC
Must Operate Voltage	3.3V Coil			2.4	Volts DC
Must Release Voltage	3.3V Coil	0.4			Volts DC
Coil Resistance	5V Coil	135.0	150.0	165.0	W
Nominal Voltage	5V Coil		5.0	6.0	Volts DC
Must Operate Voltage	5V Coil			3.8	Volts DC
Must Release Voltage	5V Coil	0.4			Volts DC
Switching Voltage	Max DC/Peak AC			125	Volts
Switching Current				0.25	Amps
Carry Current (Continuous)	Switch and Shield			0.5	Amps
Contact Rating (Resistive Load)	Resistive Load			3.0	Watts
Life Expectancy:
Signal Switching³Resistive Load³Other Load Conditions³	1VDC / 10mA 12VDC / 10mA Consult Factory		1000 1 -		x 10⁶ Ops x 10⁶ Ops -
Static Contact Resistance (initial)	0.05VDC / 10mA			0.125	W
Dynamic Contact Resistance (initial)	0.5V / 50mA 100 Hz, 1.5 mSec			0.150	W
Insulation Res - All Isolated Pins	100VDC	10¹⁰	10¹²		W
Capacitance - Across Contacts	Shield Guarding		0.2		pF
Capacitance - Open Contact to Coil	Shield Guarding		0.5		pF
Capacitance - Closed Contact to Coil	Shield Guarding		1		pF
Dielectric Strength:
Across Contacts Contact to Coil Contact to Shield	100 µA 100 µA 100 µA	150 1500 1500			V (DC/Pk AC) V (DC/Pk AC) V (DC/Pk AC)
Operate Time - (including bounce)	Nominal Voltage coil drive @ 30 Hz, square wave		100	200	µSec
Release Time - (Si diode damped)	Nominal Voltage coil drive @ 30 Hz, square wave		30	50	µSec
RF Insertion Loss⁴	-3 dB roll-off frequency	10.0			GHz
Signal Rise Time - (10% - 90%)	Corrected for measurement system response time			40	pSec


		Get It In .PDF Format

	NOTES: ¹All parameters specified per EIA/NARM standards for dry reed relays, # RS-421 and RS-436, if a suitable parametric standard exists. ²Unless otherwise noted, all parameters are specified at 25 °C and 40% RH. ³Life expectancies based on characteristic life (63.2% failure) calculated from the 2-parameter Weibull distribution. Contact resistance >2.0W defines end of life. ⁴Frequency at which the difference between output and input signal amplitude exceeds -3dB. (Direct wired using 50W coaxial cable.)

ENVIRONMENTAL RATINGS:
Storage Temperature: -35 °C to +100 °C
Operating Temperature: -20 °C to +85 °C.
Vibration: sinusoidal vibration with an amplitude of 10g over a 10Hz to 2000Hz frequency range shall not cause a closed channel activated at the nominal coil voltage to open, not an open channel to close.
Max Soldering Temperature: 226°C (438°F) max for 1 minute dwell time. Temperature measured at a relay ball termination.
Moisture sensitive component. Handle as J-STD-020B level 5a.


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